PCB Fabrication PCB 製造
PCB fabrication and assembly support for semiconductor test applications, including high-layer-count, large-format, and precision boards. We coordinate manufacturing requirements, assembly, and quality verification based on your specifications.
提供半導體測試用 PCB 製造與組裝服務，涵蓋高多層、大尺寸及精密電路板，並依據您的規格協調製造需求、組裝與品質驗證。
Final manufacturing feasibility is subject to review of the Gerber files, stack-up, materials, and design requirements.
實際製作可行性須依 Gerber 檔案、疊構、材料與設計需求進行評估。
PCB Manufacturing Capabilities PCB 製造能力
PCB Assembly｜PCB組裝
Quality first
HLS provides comprehensive PCBA solutions, from component sourcing and PCB assembly to AOI inspection and final assembly.
HLS 提供完整的 PCBA 解決方案，服務範圍涵蓋零組件採購、PCB 組裝、AOI 檢測以及最終產品組裝。
Comprehensive Assembly Support
Based on the customer’s Gerber files, BOM, drawings, and technical requirements, we support SMT, DIP, soldering, cable connection, and final product assembly.
依據客戶提供的 Gerber 檔案、BOM、圖面及技術需求，我們可提供 SMT、DIP、焊接、Cable 連接及最終產品組裝等多元化服務。
Flexible Production
Our flexible services cover prototypes, small-volume production, and mass production for semiconductor test and various electronic applications.
依據客戶提供的 Gerber 檔案、BOM、圖面及技術需求，我們可提供 SMT、DIP、焊接、Cable 連接及最終產品組裝等多元化服務。
針對半導體測試及各類電子應用，我們可依客戶需求靈活支援 Prototype（樣品製作）、小量生產至量產，提供完整且具彈性的製造服務。