Advanced MEMS Probe Solutions
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HLS provides customized MEMS probe solutions for wafer-level and semiconductor package testing.
Our product range includes MEMS buckling probes, micro-cantilever probes, and spring probes designed for fine-pitch, high-frequency, and high-parallelism test applications.
Based on each customer’s device, pad layout, pitch, force, current, and test requirements, HLS works with specialized partners to propose an optimized probe design and suitable technical solution.