Advanced MEMS Probe Solutions
MEMS probe pins, M-Pogo pins, and customized contact solutions for semiconductor testing. We help you select suitable options based on your contact specifications and test conditions.
提供半導體測試用 MEMS 探針、M-Pogo 彈簧探針與客製化接觸解決方案，依據接觸規格與測試條件，協助評估合適的產品。
HLS provides customized MEMS probe solutions for wafer-level and semiconductor package testing.
HLS 提供適用於 Wafer Level Test 與 Semiconductor Package Test 的客製化 MEMS Probe 解決方案。
Our product range includes MEMS buckling probes, micro-cantilever probes, and spring probes designed for fine-pitch, high-frequency, and high-parallelism test applications.
我們的產品涵蓋 MEMS Buckling Probe、Micro-Cantilever Probe 以及 Spring Probe，可對應 Fine Pitch、高頻以及 High Parallelism 的測試應用需求。
Based on each customer’s device, pad layout, pitch, force, current, and test requirements, HLS works with specialized partners to propose an optimized probe design and suitable technical solution.
我們的產品涵蓋 MEMS Buckling Probe、Micro-Cantilever Probe 以及 Spring Probe，可對應 Fine Pitch、高頻以及 High Parallelism 的測試應用需求。
依據客戶的 Device 結構、Pad Layout、Pitch、Contact Force、Current 及 Test Requirement，HLS 與專業合作夥伴共同評估，並提出 最佳化的 Probe Design 與合適的 Technical Solution。